The HYTV Voltage Transformation Module is a chip-form power module with ChiP (Converter Housed in Package) packaging technology. It employs advanced power topology, control, and packaging technologies, featuring high efficiency, ultra-high power density, ultra-compact size, ultra-light weight, and low EMI.  Advanced manufacturing processes ensure high parameter consistency across modules, enabling parallel operation of up to 8 units with excellent current-sharing performance. Adopting the standard Full-Chip package, it weighs only 15 g. It is equipped with comprehensive protection features, including input overvoltage and under-voltage protection, output overcurrent protection, output short-circuit protection, and over-temperature protection. When paired with an upstream HYSD Pre-Regulator Module, it forms proportional power architecture. It fits high-reliability electronic systems demanding extreme performance on power, efficiency, size, and weight and profile height.