The HYSD Series DC/DC converter is a chip-form power module with ChiP (Converter Housed in Package) packaging technology. It employs an advanced power topology circuit, utilizing cutting-edge technology for power processing, control, and packaging. It features a wide input voltage range, wide output voltage range, high efficiency, ultra-high power density, ultra-light weight, and parallel current-sharing capability. Adopting the standard Full-Chip package footprint, it achieves a High efficiency. It is equipped with comprehensive protection features, including input overvoltage/under-voltage protection, output overvoltage protection, output overcurrent protection, output short-circuit protection, and over-temperature protection. It can be cascaded with the HYTV series Voltage Transformation Module to form proportional power architecture, with adaptive compensation of the HYTV output voltage. It fits high-reliability electronic systems demanding extreme performance on power, efficiency, size, and weight and profile height.