Special features

• Multiple Package Size options: Full brick，4/3 brick，5/3 brick，Big Full brick
• Multiple Heatsink options: Open-frame，Encapsulated
• Efficient (96.5%), high power density, ultra-thin (13mm) design
• No optocoupler design, built-in output anti backflow circuit, built-in CAN user interface, supporting users to establish personalized function settings through communication, achieving system level power health management
• Active current sharing (supporting CAN bus current sharing)
• Support remote Bootloader firmware upgrade
• Support online modification of loop control parameters and support for high-capacity loads
• Support monitoring, control, and configuration of state parameters such as voltage, current, temperature, and switch logic